On Thursday, May 9, we will organize our next BCSEMI NL Membership meeting at Nexperia in Nijmegen. Please register and join us in Nijmegen!
• Date: Thursday, May 9 (14.00-17.30u)
• Location: Nexperia, Nijmegen
• Theme: “The future in packaging”
• Program:
14:00 Walk in
14:30 Welcome by Charles Smit
14:35 BCSEMI NL update by Barry Peet
14:45 Presentation “Challenges in Semiconductor Packaging”
by Rene Poelma, Senior Principal Engineer, Nexperia
15:15 Presentation “High Precision Assembly & Packaging”
by Biba Visnjicki, Director Business Development, Fraunhofer
15:45 Presentation “Vision and directions in High Volume chip assembly equipment”
by Joep Stokkermans, Innovation Manager, Nexperia
16:15 Guided Tour ITEC (Nexperia)
17:00 Networking Drinks
Join us in Nijmegen on May 9! Please register via the button on the right. We warmly welcome you at Nexperia.
Register |