APC will enable customers to reduce time to market with advanced packaging solutions for their new MEMS and Sensor products by taking integral project responsibility for customer’s packaging projects. The main activities of are development, qualifi cation, prototyping and small volume manufacturing and transfer to mass production services for MEMS, Sensors and advanced IC packaging.


The APC services are composed of five activities:

  • Package Research & Development
  • Prototype Assembly Services
  • Low to medium pre-production
  • Transfer to Mass Production
  • Project Management

APC covers the three main elements that determine the success of an
advanced IC packaging development center:

  • One-stop shop
    short lead-time due to full local service, reduction of risks and costs
  • Innovation power
    Technology and innovations that bring added value to the customer
  • Quality and reliability of services.

Special points of interest

  • Molding exposed chip surfaces with Film Assist Molding
  • FEM strength, thermodynamic/thermostatic stress simulations
  • Compound fl ow simulations
  • Silver Sinter technology and capabilities
  • In house toolshop availability

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