The probecard is a crucial part of the wafer test setup and is the electrical interface between the test system and the wafer bondpads.

BE Precision Technology

Probe misalignment, high contact resistance wil cause inconsistent test results  and or even rejects. Eliminate this variable by checking  and managing the probecard physical and electrical condition. Our probecard testers inform you quickly and accurately about the condition or your probecards.

Physical checking of the probetip locations in 3D will generate a details status report and necessary repair instructions.

Electrical verification informs you about the contact resistance throughout the entire probecard, as well as leakage between the probes and can also measure components to test the electrical status of the tester.

We are also able to compare the probecard fingerprint on the wafer and compare the details.



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