CITC is a place where companies, research, and educational institutes work together on bridging the gap from academics to industry and create new and better solutions. We offer access to innovation, infrastructure, and education.
Access to Innovation
Organizing and executing innovation programs in the field of packaging and integration technology for chips. CITC’s current program lines:
• Thermal High-Performance Packaging
• RF Chip Packaging
• Digital Package Manufacturing
• Integrated Photonics Packaging
Access to Infrastructure
CITC maintains lab facilities that support the innovation programs but also support the education programs through internships and MSc/PhD programs. CITC has a Smart Industry Field Lab status, indicating a place where industry and research organizations jointly develop, test, and implement smart industry solutions.
Access to Education
CITC collaborates with universities, applied universities, and companies to support and provide packaging and chip integration technology-related education. This includes internships, MSc/PhD programs, and a specific CITC – HAN Packaging course.