(scroll down to see the complete overview of the presentations)
Heterogenous integration at NXP
Jan Gülpen, Back End Innovation at NXP
This presentation will touch upon the outlook of heterogenous integration, the link to the products and the challenges that it brings for assembly.
Jan Gülpen works for Philips / NXP since 1995, for most of the time for Package Innovation. In his current role he leads the packaging team that is responsible for defining and executing NXP’s packaging roadmap for RF power discretes and modules as well as packages for Connectivity and Identification business. Jan is located in Nijmegen.
Application and Integration of (CMUT) Ultrasound
Johan Klootwijk, Team Lead at Philips Research
This presentation focuses on the application and integration of semiconductor-based ultrasound.
Johan Klootwijk works for Philips for almost 25 years, currently in the role of team lead. Next to this he was the overall PL of the Ulimpia project and currently he is the overall PL of the Ampere project. Both projects deal with the integration and application of ultrasound.
Unfolding Fashion Tech: micro components in garments
Marina Toeters, Fashion tech designer @by-wire.net, co-owner of the Fashion Tech Farm
This presentation covers several examples of integrated technology in garments.
Marina Toeters is initiator and the driving force behind by-wire.net. Together with a widely developed network she is dedicated to designing and prototyping innovative textile products and garments. Marina is a Red Dot winning Fashion Tech Designer. She advises – via prototyping and a research through design approach – on product development. As a teacher, coach and researcher, she works for a fashion department (HKU) and industrial design faculty (TU/e). In 2019 Marina edited the book Unfolding Fashion Tech: Pioneers of Bright Futures and opened the Fashion Tech Farm, a studio, incubator and small-scale production facility for innovative fashion, based in Eindhoven, The Netherlands.
More info: www.by-wire.net and www.fashiontechfarm.com
Assembly of a Frequency Modulated Continuous Wave LIDAR system
Peter Harmsma, Scientist at TNO
This presentation focuses on the architecture and realization of a photonics LIDAR system.
Peter Harmsma holds a PhD in integrated photonics (TU Delft, 2000). In his current position as senior scientist nano photonics at TNO he has worked in particular on photonic sensor applications such as biosensors, metrology, spectroscopy and lidar. TNO acts as a platform-agnostic photonic system house, and works with various foundries in InP, SiN and SOI for the realization and testing of prototypes.
Semiconductor trends in lighting industry
Patrick van den Heuvel, R&D Manager at Signify
Since the introduction of electronics for more efficiently driving conventional discharge lamps the use and variety of applied semiconductors has increased a lot, especially with the transitions to LED and connected lighting. As the next challenges for the lighting industry become visible, how can the semiconductor industry continue to play an important role.
Patrick van den Heuvel has an electronics background with a major in telecommunications. He has over 20 years’ experience in applying different kind of semiconductors in lighting electronic power supplies. Responsible as R&D Manager within Signify Research for driving new electronic concepts and designs to be used across different (connected) LED lighting applications such as lamps and luminaires.
MACHINE, TECHNOLOGY PERSPECTIVE AND METROLOGY DOMAINS
Backend lithography challenges for more than Moore devices
Jeroen de Boeij, System Architect at Kulicke & Soffa
There are two main trends in backend semiconductor industry for lithography. The first is the ever increasing IO density in packages and the second is the large variety of approaches to create more than Moore packages. The role of lithography in these two trends will be the topic of this presentation.
Jeroen de Boeij is system architect at Kulicke & Soffa and member of the management team of the Lithography BU. He has been working in the semicon industry since 2009. Within the lithography BU he is responsible for the R&D program.
How laser is enabling the semiconductor roadmap
Jeroen van Borkulo, Head of Business & Marketing at ASM Laser Separation International
The trend in the semiconductor industry is to make the substrates thinner and the active layers thicker. This development results in the end of life for the conventional dicing technology. Laser dicing has proven capability to separate these challenging and novel wafer technologies. ASMPT is working with technology leading semiconductor companies to support their roadmap towards AI and heterogenous integration for semiconductor.
Jeroen van Borkulo has a technical Physics background with a major in Photonics. Over 25 year experience in laser material processing and more than 20 years specifically in semiconductor materials. Responsible within ASMPT as Head of business development & marketing for the laser processing systems. Several Papers and Patents on multi beam laser dicing.
The use of integrated photonics for precision sensing
Pim Pim Kat, Chief Executive Officer at Amazec Photonics
The presentation will show the paradigm shift in sensing resolution, speed and number of sensors in one optical fiber by the use of integrated photonics chips and new architectures. A topic will be the need for further integration of functionality of optical chips and the combination of optics and electronics in a hybrid solution.
Pim Kat has a background in mechanical engineering. He worked as researcher at Hoogovens in the field of computer controlled motion (what is now mechatronics). He started his own company Technobis in 1996.
Technobis Group in 2014 consists of three companies Technobis Mechatronics (development and supply of OEM instruments), Technobis Fibre Technologies (sensing systems based on Integrated Optics) and Technobis IPPS (packaging services for integrated optical chips) and acquired Avantium Crystallization Systems in 2015. Besides being the CEO of the Group, Pim was and still is involved in most of the R&D work for integrated photonics sensing. After the acquisition of the majority of the shares of Technobis Group by Active Capital Company, Pim co-founded Amazec Photonics BV focusing on the development and production of an integrated photonics based sensing system for the early detection of heart failure.
Perspectives on emerging and disruptive technologies for microelectronics
Marcel Grooten, Managing Director at DoMicro
The presentation will highlight some new emerging (additive) technologies that could create new and disruptive effects in manufacturing of micro-electronics. Inkjet printing, electrohydrodynamic printing as well as other approaches like minimal fab are discussed.
Marcel Grooten has a passion for new technologies and high-tech industry. Seasoned in Solar, Semicon and high-tech manufacturing equipment, he is leveraging his profound knowledge, over 30 years of experience and vast network to recognize and shape new opportunities. Raised within Royal Philips Electronics and engaged in several start-up companies, Marcel is now driving innovation to market out of scale up DoMicro BV
Flux-less Thermocompression Bonding of Large Area Dies with High Density Interconnects Via In-Situ Oxide Reduction
Andreas Marte, Senior Principal Engineer at Kulicke & Soffa
Heterogeneous integration drives an aggressive interconnect pitch roadmap, enabling more efficient and higher bandwidth packages and, therefore, pushing the limits of Advanced Packaging technologies. New interconnect technologies such as Hybrid Bonding are emerging, however, Thermocompression Bonding (TCB) based on solder micro-bumps remains the well-established and cost effective fine-pitch interconnect process. TCB typically requires the application of flux and post-bond flux cleaning which becomes more and more difficult for increasing die size and with bump pitch and stand-off height shrinking even further. K&S developed and demonstrated a flux-less TCB process for large and high-density interconnect die that utilizes in-situ Formic Acid (FA) vapor application for solder oxide reduction. This process obsoletes post-bond flux cleaning and, therefore, eliminates flux residue related underfill and package reliability issues. The FA delivery system can be integrated on our high-accuracy C2S and C2W TCB tools, leveraging the existing HVM TCB infrastructure for super fine pitch applications down to 10µm.
Andreas Marte is a Senior Principal Systems Engineer in the Advanced Packaging BU of Kulicke & Soffa. He holds a PhD in Physics (TU Munich, 2003) and has been working in the Semicon industry since 2004.